| 材料/Materials |
普通Tg/Normal Tg FR4 |
| 中等Tg/Middle Tg FR4, |
| 高Tg/ High Tg FR4 |
| 特殊材料Special Material (Halogen Free, Rogers, PTFE, PI,etc) |
| 产品类型/Product type |
硬、软、软硬结合、金属基/Rigid, FPC, Rigid-Flex, Metal-base |
| 层数/Layer Counts |
2~50 |
| 板厚/Board Thickness |
最大/Max:6.0mm |
| 最小/Min:0.6mm |
| 钻孔孔径/Drill Size |
机械孔/CNC:0.2mm |
| 激光孔/Laser: 4mil |
| 板厚孔径比/Aspect Ratio |
12:1 |
| 尺寸/Dimension |
最大/Max:650mm×1000mm |
| 线宽 间距/Line Space |
内层/Inner Layer: 3mil/3mil |
| 外层/Outer Layer: 3.5mil/3.5mil |
| 阻抗公差/Impedance Tolerance |
±10% |
| 最小绝缘层厚度/Min insulated Thickness |
3mil |
| 表面处理/Surface Finish |
喷锡/HASL |
| 表面抗氧化/OSP |
| 化学镍金/Immersion Gold |
| 化学沉锡/Immersion Tin |
| 化学沉银/Immersion Silver |
| 电镀金手指/Gold Finger Plating(Finger) |
| 选择性化学镍金 表面抗氧化/Selective OSP Immersion Gold |